SK Hynix, a South Korean memory semiconductor supplier of dynamic RAM chips for mobile devices has quietly released 8 GB LPDDR4 RAM modules for mobile devices based on the company’s yet unannounced 16 Gb LPDDR4 ICs (integrated circuits).

The 8 GB LPDDR4 chip consists of four 16 Gb DRAM circuits featuring 3733 MT/s of transfer rate and up to 29.8 GB/s bandwidth when paired with a 64-bit processor. The RAM package comes with standard 66-ball or 376-ball form-factor which is compatible with most mobile devices.

SK Hynix’s 8 GB LPDDR4 RAM chips are built using the company’s 21 nm manufacturing technology. While Samsung uses 10 nm manufacturing technology to build its 8 GB LPDDR4 RAM chips, which allows Samsung to push data transfer rate up to 4266 MT/s on its chips.

The company hasn’t made any official announcements about the new 8 GB LPDDR4 ROM chips for mobile devices as per the product catalog, the chips are production ready and we expect select Android devices to feature the chips in 2017.