Kirin 970, which is a successor to Kirin 960 chipset, is Huawei’s in-house chipset for Huawei devices. Looks like we have some new scoop on the upcoming SoC, Kirin 970.
According to the Weibo user, Ice Universe, the upcoming Kirin 970 will be based on 12nm chip squashing the previous rumors, which suggested the chipset will be built on 10nm tech. In case you are wondering, the current Kirin 960 is based on 16nm technology.
Kirin 960 is part of the latest release from Huawei, the Honor 9 device, which was launched yesterday. Other than Kirin 960, the smartphone features 5.15-inch FHD display, 3,200mAh battery and front fingerprint sensor. It comes in three variants of 4GB RAM/64GB memory, 6GB RAM/64GB memory and 6GB RAM/128GB memory.
The first chipset from Huawei made its debut in 2015 with the Kirin 950 followed by Kirin 960 in 2016. Although there isn’t much news about Kirin 970, it will most probably launch in Q4 2017.
Interestingly, Samsung is also working on two chipsets, one that is an incremental upgrade to Snapdragon 835, Snapdragon 836 and another Snapdragon 845 chipset. While Snapdragon 836 is expected to release next month, Snapdragon 845 will release in January 2018.
Source: Weibo
